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Shulin Bai

Professor

Tel: +86-(10)-62759379

Email address: slbai@pku.edu.cn

Office: RM807, Wang Kezhen Building, Peking University, Haidian District, Beijing 100871, P.R.China, 100871

Group Website:http://www2.coe.pku.edu.cn/subpaget.asp?id=393


RESEARCH INTERESTS

Polymer composites have broad applications in many industrial fields. Our research involves high performance and advanced nanocomposites for heat management and multifunctional application. We focus on the development of new thermal interface materials, functional/structural materials for their applications in electronics, batteries, aerospace and automobiles.


EDUCATION

1989–1994, Ph.D., Laboratory des Sols, Structure et Materiaux, Ecole des Arts et Manufacture de Paris, France (Supervisor: Professor M. Andreani)

1983-1986, M.S., Department of Engineering Mechanics, Dalian University of Technology, China (Supervisor: Professor Wu Shen)

1979–1983, B.S., Department of Materials Engineering, Dalian University of Technology, China


PROFESSIONAL EXPERIENCE

2006–present, Professor, School of Materials Science and Engineering, Peking University, China

1996 – 2006 Associate and full Professor, School of Engineering, Peking University, China

1994–1996, Postdoc, Department of Mechanical Engineering, Peking University, China (Advisor: Prof. Mingbao Han)

1986-1988, Engineer, Institute of Metals and Chemistry, Chinese Academy of Railway Science, Beijing, China


SELECTED PUBLICATIONS

1.  H. Fang, Y. Zhao, Y. Zhang, Y. Ren, S. Bai*, 3D graphene foam filled elastomer composites with high thermal and mechanical properties. ACS Applied Materials & Interfaces, 2017, 9(31) 26447-26459.

2.  Y. Zhang, Y. Ren, S. Bai*, Vertically aligned graphene film/epoxy composites as heat dissipating. Intern J of Heat and Mass Transfer, 2018,118, 510-517

3. Y. Ren, Y. Zhang, H. Fang, S. Bai*, A trade-off study toward highly thermally conductive and mechanically robust thermoplastic composites by injection moulding. Comp Sci and Tech, 2019, Vol.183, 107787.

4. Y. Ren, L. Ren, J. Li, R. Lv, L. Wei, D. An, M. Maqbool, S. Bai*, C. Wong, Enhanced thermal conductivity in polyamide 6 composites based on the compatibilization effect of polyether-grafted graphene. Comp Sci and Tech, 2020, Vol.199, 108340.

5.  M. Maqbool, H. Guo, A. Bashir, A. Usman, A. Abid, G. He, Y. Ren, Z. Ali, S.L. Bai*, Enhancing through-plane thermal conductivity of fluoropolymer composite by developing in situ nano-urethane linkage at graphene–graphene interface. Nano Research, 2020, 13(10): 2741–2748.

6.  H. Guo, H. Zhao, H. Niu, Y. Ren, H. Fang, X. Fang, R. Lv, M. Maqbool, S. Bai*, Highly thermally conductive 3D printed graphene filled polymer composites for scalable thermal management applications. ACS Nano, 2021, 15(4), 6917-6928.

7.  H. Niu, H. Guo, Y. Ren, L. Ren, R. Lv, L. Kang, A. Bashir, S. Bai*, Spherical aggregated BN /AlN filled silicone composites with enhanced through-plane thermal conductivity assisted by vortex flow. Chemical Engineering Journal, 2022, 430, 133155.

8.  H. Ni, H. Guo, L. Kang, L. Ren, R. Lv, S. Bai*, Vertical alignment of anisotropic fillers assisted by expansion flow in polymer composites. Nano-Micro Lett., 2022, 14:153.

9.  H. Guo, H. Niu, H. Zhao, L. Kang, Y. Ren, R. Lv, L. Ren, M. Maqbool, A. Bashir, S. Bai*, Highly anisotropic thermal conductivity of three-dimensional rinted boron nitride-filled thermoplastic polyurethane composites: effects of size, orientation, viscosity, and voids, ACS Appl. Mater. Interfaces, 2022, 14, 14568−14578.